Invention Grant
- Patent Title: Modular and tiled optical sensors
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Application No.: US17417533Application Date: 2019-04-30
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Publication No.: US12031915B2Publication Date: 2024-07-09
- Inventor: Alexander Govyadinov , Brett E. Dahlgren , Brian John Keefe
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- International Application: PCT/US2019/030029 2019.04.30
- International Announcement: WO2020/222825A 2020.11.05
- Date entered country: 2021-06-23
- Main IPC: G01N21/64
- IPC: G01N21/64

Abstract:
An example device includes an array of sensor modules. A sensor module includes a body to be positioned in alignment with a planar target, a light source coupled to the body to emit light to the planar target along a source optical path, and a plurality of light sensors coupled to the body. Each light sensor is to sense a different wavelength of light received from the planar target along a sensor optical path. The sensor optical path is different from the source optical path. The bodies of the array of sensor modules are arranged in a planar tiling pattern with respect to a longitudinal axis of the planar target.
Public/Granted literature
- US11879844B2 Modular and tiled optical sensors Public/Granted day:2024-01-23
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