Invention Grant
- Patent Title: Testing device and method for testing a device under test
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Application No.: US17722219Application Date: 2022-04-15
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Publication No.: US12032001B2Publication Date: 2024-07-09
- Inventor: Jia Jin Lin , Chia Hsiang Wang , Shih Pin Chung , Wei Shuo Chu , You Lin Lee , Pin Heng Kuo , Cheng Chia Tu
- Applicant: Advanced Semiconductor Engineering, Inc. , ASE TEST, INC.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.,ASE TEST, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.,ASE TEST, INC.
- Current Assignee Address: TW Kaohsiung; TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R1/04 ; G01R31/28
Abstract:
A testing device is disclosed. The testing device includes a socket configured to support a DUT and a first detection module disposed at a first side of the socket and configured to detect a location relationship between the DUT and the socket.
Public/Granted literature
- US20230333139A1 TESTING DEVICE AND METHOD FOR TESTING A DEVICE UNDER TEST Public/Granted day:2023-10-19
Information query
