Invention Grant
- Patent Title: Chevron interconnect for very fine pitch probing
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Application No.: US17677847Application Date: 2022-02-22
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Publication No.: US12032002B2Publication Date: 2024-07-09
- Inventor: Pooya Tadayon
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R1/073 ; G01R31/28

Abstract:
An apparatus an apparatus comprising: a substrate having a plane; and an array of at least one conductive probe having a base affixed to the substrate, the at least one conductive probe having a major axis extending from the plane of the substrate and terminating at a tip, wherein the one or more conductive probes comprise at least three points that are non-collinear.
Public/Granted literature
- US20220178966A1 CHEVRON INTERCONNECT FOR VERY FINE PITCH PROBING Public/Granted day:2022-06-09
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