Integrated circuit packages (100) having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a structured glass article (120) including a glass substrate (122), an optical channel (132), and redistribution layers. The integrated circuit package (100) further includes an integrated circuit chip (160) positioned on the glass substrate (122) and in optical communication with the optical channel (132) and in electrical continuity with the redistribution layers (136).