Invention Grant
- Patent Title: Method and electronic device for communication on single wire interface preliminary class
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Application No.: US18115474Application Date: 2023-02-28
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Publication No.: US12032502B2Publication Date: 2024-07-09
- Inventor: Aniroop Mathur , Archit Tekriwal , Anil Kumar , Kuldeep Kumar
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: IN 2241003263 2022.01.20
- Main IPC: G06F13/26
- IPC: G06F13/26 ; G06F3/023

Abstract:
A first electronic device for communication with a second electronic device on a single wire interface, includes: a memory; and a processor executing an application stored in the memory. The processor is configured to: receive, from the second electronic device, interrupt signals related with a frequency and a time space, over the single wire interface; decode an input data associated with the interrupt signals based on an interrupt protocol table; and provide the decoded input data to the application on the first electronic device.
Public/Granted literature
- US20230229608A1 METHOD AND ELECTRONIC DEVICE FOR COMMUNICATION ON SINGLE WIRE INTERFACE Public/Granted day:2023-07-20
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