Invention Grant
- Patent Title: Method for determining laser machining parameters and laser machining device using this method
-
Application No.: US16964147Application Date: 2019-01-25
-
Publication No.: US12032878B2Publication Date: 2024-07-09
- Inventor: David Bruneel , Liliana Cangueiro , Paul-Etienne Martin , José-Antonio Ramos De Campos , Axel Kupisiewicz
- Applicant: LASER ENGINEERING APPLICATIONS
- Applicant Address: BE Angleur
- Assignee: LASER ENGINEERING APPLICATIONS
- Current Assignee: LASER ENGINEERING APPLICATIONS
- Current Assignee Address: BE Angleur
- Agency: CHRISTENSEN O'CONNOR JOHNSON KINDNESS PLLC
- Priority: BE 185046 2018.01.26
- International Application: PCT/EP2019/051914 2019.01.25
- International Announcement: WO2019/145513A 2019.08.01
- Date entered country: 2020-07-22
- Main IPC: G06F30/20
- IPC: G06F30/20 ; B23K26/06 ; B23K26/0622 ; B23K26/082 ; B23K26/359 ; B23K26/382 ; B23K26/40 ; B23K26/70 ; G05B19/4155

Abstract:
Method for determining laser machining parameters for the machining of a material using a laser machining system comprises the following steps: a) providing said central unit with a learning machining function capable of learning on the basis of said plurality of machining data samples, said learning machining function comprising an algorithm capable of defining the following laser machining parameters for said machining result sought and for said machining system: a polarization, an pulse energy Ep, a diameter at the focal point w, a Gaussian order p, a pulse repetition rate PRR of pulses n, a wavelength; b) making said learning machining function to learn so as to said laser machining system can machine said material to be machined according to the machining result sought.
Public/Granted literature
- US20210031304A1 METHOD FOR DETERMINING LASER MACHINING PARAMETERS AND LASER MACHINING DEVICE USING THIS METHOD Public/Granted day:2021-02-04
Information query