Invention Grant
- Patent Title: Reduction of high tape contact pressure points against head assembly
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Application No.: US17991620Application Date: 2022-11-21
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Publication No.: US12033674B2Publication Date: 2024-07-09
- Inventor: Oscar J. Ruiz , Kenji Kuroki , Eduardo Torres Mireles
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: PATTERSON + SHERIDAN, LLP
- Main IPC: G11B15/60
- IPC: G11B15/60 ; G11B5/255 ; G11B5/265 ; G11B5/40

Abstract:
The present disclosure generally relates to a head assembly in a data storage device. The data storage device may include magnetic media embedded in the device or magnetic media from an insertable cassette or cartridge (e.g., in an LTO drive), where the head assembly reads from and writes to the magnetic media. During device operation, the magnetic media moves across the head assembly. The magnetic media experiences higher contact stress at certain points or portions of the head assembly. A sensor guard is coupled to the head assembly. The sensor guard comprises at least one chamfered surface or at least one stepped surface to decrease the contact stress between the magnetic media and the head assembly during device operation. The at least one chamfered or stepped surface may be disposed on a leading edge of the sensor guard.
Public/Granted literature
- US20230087767A1 Reduction Of High Tape Contact Pressure Points Against Head Assembly Public/Granted day:2023-03-23
Information query
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