Invention Grant
- Patent Title: Cable bonding protection for head dimensional stability
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Application No.: US17476720Application Date: 2021-09-16
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Publication No.: US12033678B2Publication Date: 2024-07-09
- Inventor: Jason Liang , Hoodin Hamidi , Daniel Brown
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Zilka-Kotab, P.C.
- Main IPC: G11B5/48
- IPC: G11B5/48 ; G01B3/1094 ; G11B5/584

Abstract:
An apparatus includes a beam, a chip coupled to the beam, a cable coupled to the beam by a first material located at opposite edges of the cable, and wire bonds extending from pads of the cable to pads of the chip. An apparatus includes a beam and a chip coupled to the beam. The chip includes an array of magnetic transducers for transducing data on a magnetic recording tape. The apparatus includes a cable coupled to the beam by a first material located at opposite edges of the cable, wire bonds extending from pads of the cable to pads of the chip, and a second material encapsulating ends of the wire bonds that are located adjacent the cable. The second material does not contact the chip.
Public/Granted literature
- US20230081254A1 CABLE BONDING PROTECTION FOR HEAD DIMENSIONAL STABILITY Public/Granted day:2023-03-16
Information query
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