Invention Grant
- Patent Title: Multilayer capacitor
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Application No.: US17706785Application Date: 2022-03-29
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Publication No.: US12033803B2Publication Date: 2024-07-09
- Inventor: Man Su Byun , Se Hun Park , Soo Hwan Son , Taek Jung Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20210194080 2021.12.31
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G2/06 ; H01G4/012 ; H01G4/12 ; H05K1/11

Abstract:
A multilayer capacitor includes: a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other having at least one dielectric layer interposed therebetween in a first direction; first and second external electrodes disposed on the body while being spaced apart from each other to be respectively connected to first internal electrode and second internal electrode; and first and second bumps respectively having one surfaces disposed on the first or second external electrode and including at least one hole positioned in the one surface or the other surface, wherein AV indicates a total area of the at least one hole, AB indicates an area of the one surface of the first or second bump, facing the first or second external electrode, and AV/AB is greater than 0.012 and less than 0.189.
Public/Granted literature
- US20230215648A1 MULTILAYER CAPACITOR Public/Granted day:2023-07-06
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