Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US17708461Application Date: 2022-03-30
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Publication No.: US12033804B2Publication Date: 2024-07-09
- Inventor: Seo Won Jung , Won Kuen Oh , Gyu Ho Yeon , Seo Ho Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20210192965 2021.12.30
- Main IPC: H01G4/008
- IPC: H01G4/008 ; H01G4/012 ; H01G4/12 ; H01G4/30

Abstract:
A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer interposed therebetween, and external electrodes disposed on the body, wherein the external electrode include a first electrode layer disposed on two end surfaces and a second electrode layer including a center portion disposed on the first electrode layer and a band portion extending from the center portion onto a portion of a first surface and a portion of a second surface, the first electrode layer includes a conductive metal, the second electrode layer includes silver (Ag) and glass and further includes one or more of palladium (Pd), platinum (Pt), and gold (Au), and ta
Public/Granted literature
- US20230215650A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2023-07-06
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