Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US17969189Application Date: 2022-10-19
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Publication No.: US12033805B2Publication Date: 2024-07-09
- Inventor: Seon Ho Park , Jae Seok Yi , Moon Soo Park , Chang Hak Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20220064307 2022.05.25
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/008 ; H01G4/012 ; H01G4/12

Abstract:
A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, external electrodes disposed on the body to be connected to the internal electrodes, and a metal oxide disposed between the body and the external electrodes. The metal oxide includes calcium (Ca), zinc (Zn), and silicon (Si), and further includes at least one selected from the group consisting of barium (Ba), boron (B), and aluminum (Al).
Public/Granted literature
- US20230386749A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2023-11-30
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