Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US17326821Application Date: 2021-05-21
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Publication No.: US12033872B2Publication Date: 2024-07-09
- Inventor: Keita Hirase , Koji Ogura , Hiroshi Yoshida , Takashi Nagai , Jun Nonaka , Takumi Honda
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JP 20090897 2020.05.25 JP 21066941 2021.04.12
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/311

Abstract:
A substrate processing apparatus includes: a processing container, a mixing device, a liquid feeding path, and a controller. The processing container processes a substrate by immersing the substrate in a processing liquid. The mixing device mixes a phosphoric acid aqueous solution and an additive, to produce a mixed liquid to be used as a raw material of the processing liquid. The liquid feeding path feeds the mixed liquid from the mixing device to the processing container. The controller controls the substrate processing apparatus. The controller performs a control to feed the mixed liquid from the mixing device to the processing container in which the substrate is immersed, after a phosphoric acid concentration of the mixed liquid is regulated from a first concentration to a second concentration higher than the first concentration. The first concentration is a concentration when the phosphoric acid aqueous solution is supplied to the mixing device.
Public/Granted literature
- US20210366740A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2021-11-25
Information query
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