Invention Grant
- Patent Title: Ventilated wafer cassette
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Application No.: US17696992Application Date: 2022-03-17
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Publication No.: US12033877B2Publication Date: 2024-07-09
- Inventor: Wei Gao
- Applicant: BEIJING TONGMEI XTAL TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing
- Assignee: Beijing Tongmei Xtal Technology Co., Ltd.
- Current Assignee: Beijing Tongmei Xtal Technology Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Clements Bernard Walker
- Agent Christopher L. Bernard
- Priority: CN 2121430104.8 2021.06.25
- Main IPC: H01L21/673
- IPC: H01L21/673

Abstract:
A ventilated wafer cassette is provided. The cassette comprises an upper box, a lower box, and an inner box, wherein the upper box is fitted on the lower box to form a hollow structure, in which the inner box is disposed. At least one ventilation channel connecting the hollow structure with an external environment is provided in the upper box, in the lower box or at the connection between the upper box and the lower box. The ventilated wafer cassette of the present application can ensure gas exchange during the gas protection process conducted on semiconductor wafers, thereby preventing deformation of the wafer cassette due to pressure differences. Preferably, the interior of the ventilation channel is provided with a dustproof labyrinth structure, thereby preventing the entry of dust.
Public/Granted literature
- US20220415684A1 VENTILATED WAFER CASSETTE Public/Granted day:2022-12-29
Information query
IPC分类: