Invention Grant
- Patent Title: Substrate transfer apparatus and substrate processing system
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Application No.: US18230929Application Date: 2023-08-07
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Publication No.: US12033878B2Publication Date: 2024-07-09
- Inventor: Tatsuo Hatano , Tetsuya Miyashita , Naoki Watanabe , Naoyuki Suzuki
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JP 19217076 2019.11.29
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B25J9/02 ; B25J9/12 ; B25J11/00 ; H02K7/14 ; H02K41/02 ; H01L21/67 ; H01L21/687
Abstract:
A substrate transfer apparatus includes a planar motor provided in a transfer chamber and having coils arranged therein, a transfer unit movable on the planar motor, and a control unit configured to control an energization of the coils. The transfer unit includes two bases having magnets arranged thereon and configured to be movable on the planar motor, a substrate support member configured to support a substrate, and a link mechanism configured to connect the two bases and the substrate support member to each other.
Public/Granted literature
- US20230377927A1 SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE PROCESSING SYSTEM Public/Granted day:2023-11-23
Information query
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