Invention Grant
- Patent Title: Transistor package comprising thermally conductive and electrically insulating layer
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Application No.: US18329220Application Date: 2023-06-05
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Publication No.: US12033908B2Publication Date: 2024-07-09
- Inventor: Charles Ingalz , Bozhi Yang
- Applicant: Lunar Energy, Inc.
- Applicant Address: US CA Mountain View
- Assignee: Lunar Energy, Inc.
- Current Assignee: Lunar Energy, Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Van Pelt, Yi & James LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/373 ; H01L23/40
Abstract:
Embodiments of a transistor package construction is disclosed, including: a transistor comprising: a source; and a drain; and a package comprising: a metallic back surface that is electrically connected to the drain; a top surface comprising a notch; and a thermally conductive and electrically insulating layer covering at least a portion of the metallic back surface of the package.
Public/Granted literature
- US20230395447A1 TRANSISTOR PACKAGE CONSTRUCTION Public/Granted day:2023-12-07
Information query
IPC分类:
