A cooling apparatus includes: a main body configured to provide a cooling water flow path in an inner space, a plurality of cooling jackets each including a plurality of cooling fins, the plurality of cooling fins being disposed inside the main body along the cooling water flow path and spaced apart from each other by a set distance, and a plurality of double-sided chip modules disposed between at least two of the plurality of cooling jackets and having an upper surface and a lower surface contacting the at least two cooling jackets. Each module of the plurality of double-sided chip modules is (i) located at a position corresponding to a position of one of the plurality of cooling fins, (ii) facing the one of the plurality of cooling fins, and (iii) spaced apart from at least one other module to simultaneously cool the upper surface and the lower surface.