Invention Grant
- Patent Title: Electrical fuse structure and method of formation
-
Application No.: US16696929Application Date: 2019-11-26
-
Publication No.: US12033939B2Publication Date: 2024-07-09
- Inventor: Shien-Yang Wu , Wei-Chang Kung
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- The original application number of the division: US15677881 2017.08.15
- Main IPC: H01L23/525
- IPC: H01L23/525 ; H01L23/522

Abstract:
Various fuse structures are disclosed herein that exhibit improved performance, such as reduced electro-migration. An exemplary fuse structure includes an anode, a cathode, and a fuse link extending between the anode and the cathode. A plurality of anode contacts are coupled to the anode, and a plurality of cathode contacts are coupled to the cathode. The plurality of cathode contacts are arranged symmetrically with respect to a centerline of the fuse link.
Public/Granted literature
- US20200098687A1 Electrical Fuse Structure and Method of Formation Public/Granted day:2020-03-26
Information query
IPC分类: