Invention Grant
- Patent Title: Apparatus for separating semiconductor elements and method for fabricating light-emitting elements using the same
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Application No.: US17382825Application Date: 2021-07-22
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Publication No.: US12033988B2Publication Date: 2024-07-09
- Inventor: In Hyuk Kim , Dong Gyun Kim , Jae Hoon Jung , Jin Oh Kwag , Hee Yeon Yoo , Sung Chan Jo , Jeong In Choi , Hye Jung Hong , Jong Hyuk Kang , Dong Eon Lee , Hyun Min Cho
- Applicant: Samsung Display Co., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: KILE PARK REED & HOUTTEMAN PLLC
- Priority: KR 20200093975 2020.07.28
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L21/68 ; H01L21/78 ; H01L33/00
Abstract:
An apparatus includes a base including a receiving portion that receives a substrate on which semiconductor elements are disposed; and at least one ultrasonic generator that generates and applies ultrasonic waves to the substrate placed in the base.
Public/Granted literature
Information query
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