Invention Grant
- Patent Title: Solid-state imaging device
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Application No.: US17393751Application Date: 2021-08-04
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Publication No.: US12034016B2Publication Date: 2024-07-09
- Inventor: Masaki Funaki
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: JP 16185672 2016.09.23
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N23/745 ; H04N25/57 ; H04N25/585 ; H04N25/589 ; H04N25/65 ; H04N25/702 ; H04N25/75 ; H04N25/76 ; H04N25/771 ; H04N25/79 ; H01L23/38 ; H01L25/16 ; H01L31/024

Abstract:
A first pixel circuit has a plurality of photodiodes of different sizes. A second pixel circuit is connected to the first pixel circuit, and has a holding portion that holds a first optical signal and a second optical signal. The peripheral circuit drives and controls the second pixel circuit, and determines whether a voltage value of the first optical signal is equal to or greater than a predetermined value. When it is determined that the voltage value of the first optical signal is equal to or greater than the predetermined value, a signal obtained by adding the second optical signal to the first optical signal is set as an output signal. When it is determined that the voltage value of the first optical signal is less than the predetermined value, the first optical signal is set as an output signal.
Public/Granted literature
- US20210368090A1 SOLID-STATE IMAGING DEVICE Public/Granted day:2021-11-25
Information query
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