Invention Grant
- Patent Title: LED package set and LED bulb including same
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Application No.: US17713177Application Date: 2022-04-04
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Publication No.: US12034031B2Publication Date: 2024-07-09
- Inventor: Seong Jin Lee , Jong Kook Lee
- Applicant: Seoul Semiconductor Co., Ltd.
- Applicant Address: KR Ansan-si
- Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: KR 20170067992 2017.05.31
- Main IPC: H01L27/15
- IPC: H01L27/15 ; F21K9/235 ; H01L33/50 ; F21Y113/13 ; F21Y115/10

Abstract:
A light emitting device including a first light source including a plurality of first light emitting structures and a first wavelength converter and configured to emit a first light, a second light source including a second light emitting structure and a second wavelength converter and configured to emit a second light, and a resistor member connected to the first light source and configured to distribute current to the first light emitting structures, in which a color temperature of the first light is configured to be higher than that of the second light, and the first light and second light are configured to have different light intensity.
Public/Granted literature
- US20220231077A1 LED PACKAGE SET AND LED BULB INCLUDING SAME Public/Granted day:2022-07-21
Information query
IPC分类: