- Patent Title: Three electrode capacitor structure using spaced conductive pillars
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Application No.: US17451172Application Date: 2021-10-18
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Publication No.: US12034039B2Publication Date: 2024-07-09
- Inventor: EeJan Khor , Ramasamy Chockalingam , Juan Boon Tan
- Applicant: GlobalFoundries Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Hoffman Warnick LLC
- Agent Anthony Canale
- Main IPC: H01L49/02
- IPC: H01L49/02

Abstract:
A capacitor structure for an integrated circuit (IC) and a related method of forming are disclosed. The capacitor structure includes three electrodes. A planar bottom electrode has a first insulator layer thereover. A middle electrode includes a conductive layer over the first insulator layer and a plurality of spaced conductive pillars contacting the conductive layer. A second insulator layer extends over and between the plurality of spaced conductive pillars and contacts the conductive layer. An upper electrode extends over the second insulator layer, and hence, over and between the plurality of spaced conductive pillars. A length of the upper electrode can be controlled, in part, by the number and dimensions of the conductive pillars to increase capacitance capabilities per area.
Public/Granted literature
- US20230123402A1 THREE ELECTRODE CAPACITOR STRUCTURE USING SPACED CONDUCTIVE PILLARS Public/Granted day:2023-04-20
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