Invention Grant
- Patent Title: Solid-state imaging device and electronic apparatus
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Application No.: US18017526Application Date: 2021-09-02
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Publication No.: US12035063B2Publication Date: 2024-07-09
- Inventor: Kimiyasu Shiina , Kei Nakagawa , Atsushi Suzuki , Shuntaro Izumi , Kohei Yamada
- Applicant: Sony Group Corporation , Sony Semiconductor Solutions Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Group Corporation,Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Group Corporation,Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Tokyo; JP Kanagawa
- Agency: Michael Best & Friedrich LLP
- Priority: JP 20155715 2020.09.16
- International Application: PCT/JP2021/032248 2021.09.02
- International Announcement: WO2022/059499A 2022.03.24
- Date entered country: 2023-01-23
- Main IPC: H04N25/79
- IPC: H04N25/79 ; H04N25/13 ; H04N25/131 ; H04N25/65 ; H04N25/766 ; H04N25/77 ; H04N25/78

Abstract:
Accuracy of results obtained by integrally processing information acquired by different sensors is improved. A solid-state imaging device according to an embodiment includes: a first sensor that detects light in a first wavelength band; and a second sensor that detects light of a second wavelength band different from the first wavelength band, in which the first sensor includes a first pixel (110) that detects light of the first wavelength band in incident light, and the second sensor includes a second pixel (110) that detects light in the second wavelength band that has transmitted through the first pixel among the incident light.
Public/Granted literature
- US20230362518A1 SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2023-11-09
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