Invention Grant
- Patent Title: Method for producing an electronic component which includes a self-assembled monolayer
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Application No.: US17251669Application Date: 2019-06-11
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Publication No.: US12035546B2Publication Date: 2024-07-09
- Inventor: Peer Kirsch , Sebastian Resch , Henning Seim , Marc Tornow , Takuya Kamiyama , Gerd-Volker Roeschenthaler , Romana Pajkert , Jacob Woodruff , Charith Nanayakkara
- Applicant: MERCK PATENT GMBH
- Applicant Address: DE Darmstadt
- Assignee: MERCK PATENT GMBH
- Current Assignee: MERCK PATENT GMBH
- Current Assignee Address: DE Darmstadt
- Agency: Millen, White, Zelano & Branigan, P.C.
- Agent Brion P. Heaney
- Priority: DE 2018004733.5 2018.06.14
- International Application: PCT/EP2019/065160 2019.06.11
- International Announcement: WO2019/238649A 2019.12.19
- Date entered country: 2020-12-11
- Main IPC: H10K19/20
- IPC: H10K19/20 ; H10K19/00
Abstract:
The invention relates to a process for the production of an electronic component comprising a self-assembled monolayer (SAM) using compounds of the formula I
R1-(A1-Z1)r—(B1)n—(Z2-A2)s-Sp-G (I)
in which the groups occurring have the meanings defined in Claim 1; the present invention furthermore relates to the use of the components in electronic switching elements and to compounds for the production of the SAM.
R1-(A1-Z1)r—(B1)n—(Z2-A2)s-Sp-G (I)
in which the groups occurring have the meanings defined in Claim 1; the present invention furthermore relates to the use of the components in electronic switching elements and to compounds for the production of the SAM.
Public/Granted literature
- US20210257569A1 METHOD FOR PRODUCING AN ELECTRONIC COMPONENT WHICH INCLUDES A SELF-ASSEMBLED MONOLAYER Public/Granted day:2021-08-19
Information query
