Invention Grant
- Patent Title: Circuit layout
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Application No.: US18325501Application Date: 2023-05-30
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Publication No.: US12039246B2Publication Date: 2024-07-16
- Inventor: Shih-Wei Peng , Kam-Tou Sio , Jiann-Tyng Tzeng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Merchant & Gould P.C.
- The original application number of the division: US17232571 2021.04.16
- Main IPC: G06F30/392
- IPC: G06F30/392 ; G06F30/394 ; G06F30/396

Abstract:
Generating a circuit layout is provided. A circuit layout associated with a circuit is received. A parallel pattern recognition is performed on the circuit layout. Performing the parallel pattern recognition includes determining that there is a parallel pattern in the circuit layout. In response to determining that there is a parallel pattern in the circuit layout, a cell swap for a first cell associated with the parallel pattern with a second cell is performed. After the cell swap for the first cell, engineering change order routing is performed to connect the second cell in the circuit layout. An updated circuit layout having the second cell is provided.
Public/Granted literature
- US20230297755A1 Circuit Layout Public/Granted day:2023-09-21
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