Invention Grant
- Patent Title: Connector for electrically connecting a module substrate and a main substrate
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Application No.: US18218924Application Date: 2023-07-06
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Publication No.: US12039384B2Publication Date: 2024-07-16
- Inventor: Osamu Hashiguchi
- Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP 22129694 2022.08.16
- Main IPC: G06K13/06
- IPC: G06K13/06 ; H01R12/89 ; H01R13/629

Abstract:
A connector electrically connecting a module substrate and a main substrate includes: a housing mounted on the main substrate; contacts held on the housing and including contact parts and connection parts connected to the main substrate; a frame including side board parts sandwiching a flat board part and the main substrate, the side board parts forming one of a cam groove and a projection; and a slider having opposite side portions forming the other of the cam groove and the projection, forming an insertion space between the slider and the housing upon the projection's insertion into the cam groove and the slider's attachment to the frame, pressing the module substrate against the contact parts upon the slider sliding in the module substrate's insertion direction, sandwiching main substrate, the housing and the module substrate between the slider and the flat board part.
Public/Granted literature
- US20240062028A1 CONNECTOR Public/Granted day:2024-02-22
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