Invention Grant
- Patent Title: Circuit board and method for manufacturing electrical connection box including circuit board
-
Application No.: US17598046Application Date: 2020-01-27
-
Publication No.: US12040245B2Publication Date: 2024-07-16
- Inventor: Akira Haraguchi
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Yokkaichi
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Yokkaichi; JP Yokkaichi; JP Osaka
- Agency: Honigman LLP
- Priority: JP 19060938 2019.03.27
- International Application: PCT/JP2020/002773 2020.01.27
- International Announcement: WO2020/195104A 2020.10.01
- Date entered country: 2021-09-24
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56 ; H01L25/07 ; H01L23/00 ; H01L23/14 ; H01L23/538

Abstract:
Provided is a circuit board on which an electronic component including a first terminal and a second terminal that are arranged side by side is to be mounted, the circuit board including: an insulating holding member, a conductive plate, and a signal circuit, in which the conductive plate is held by the holding member, the first terminal is joined to the conductive plate, the signal circuit is formed on a surface of the holding member using conductive nanoink containing a flux, and an end portion of the signal circuit and the second terminal are joined to each other using solder.
Public/Granted literature
- US20220165636A1 CIRCUIT BOARD AND METHOD FOR MANUFACTURING ELECTRICAL CONNECTION BOX INCLUDING CIRCUIT BOARD Public/Granted day:2022-05-26
Information query
IPC分类: