Invention Grant
- Patent Title: Fin-shaped semiconductor device, fabrication method, and application thereof
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Application No.: US17603541Application Date: 2021-03-03
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Publication No.: US12040356B2Publication Date: 2024-07-16
- Inventor: Zilan Li
- Applicant: GUANGDONG ZHINENG TECHNOLOGY CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: GUANGDONG ZHINENG TECHNOLOGY CO., LTD.
- Current Assignee: GUANGDONG ZHINENG TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: Casimir Jones SC
- Agent Tyler Sisk
- Priority: CN 2010288959.5 2020.04.13
- International Application: PCT/CN2021/078957 2021.03.03
- International Announcement: WO2021/208623A 2021.10.21
- Date entered country: 2021-10-13
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L21/8252 ; H01L27/092 ; H01L29/66 ; H01L29/778

Abstract:
A semiconductor device and a method of fabricating the same are proposed. The semiconductor device includes a plurality of hole-channel Group III nitride devices and a plurality of electron-channel Group III nitride devices. In the above, the hole-channel Group III nitride devices and the electron-channel Group III nitride devices are arranged in correspondence with each other. The electron-channel Group III nitride device has a fin-shaped channel, and a two-dimensional hole gas and/or a two-dimensional electron gas can be simultaneously formed at an interface between a compound semiconductor layer and a nitride semiconductor layer.
Public/Granted literature
- US20230268381A2 Fin-Shaped Semiconductor Device, Fabrication Method, and Application Thereof Public/Granted day:2023-08-24
Information query
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