Invention Grant
- Patent Title: Semiconductor structure and method for manufacturing the same
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Application No.: US17504599Application Date: 2021-10-19
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Publication No.: US12040406B2Publication Date: 2024-07-16
- Inventor: Erh-Kun Lai
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/8234 ; H01L29/423 ; H01L29/66

Abstract:
A semiconductor structure is provided. The semiconductor structure includes a substrate and a bottom dielectric layer continuously disposed on the substrate. The semiconductor structure further includes a plurality of stacks disposed on the bottom dielectric layer. Each of the stacks includes gate electrodes and semiconductor layers disposed alternately. The semiconductor structure further includes a plurality of source/drain structures disposed on the bottom dielectric layer and between the stacks. The semiconductor structure further includes a plurality of conductors landed on highest gate electrodes of the stacks.
Public/Granted literature
- US20230118088A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2023-04-20
Information query
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