Invention Grant
- Patent Title: Packaging structure radiating electromagnetic wave in horizontal direction and vertical direction and method making the same
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Application No.: US17705121Application Date: 2022-03-25
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Publication No.: US12040546B2Publication Date: 2024-07-16
- Inventor: Yenheng Chen , Chengchung Lin
- Applicant: SJ Semiconductor(Jiangyin) Corporation
- Applicant Address: CN Jiangyin
- Assignee: SJ Semiconductor(Jiangyin) Corporation
- Current Assignee: SJ Semiconductor(Jiangyin) Corporation
- Current Assignee Address: CN Jiangyin
- Agency: IPRTOP LLC
- Priority: CN 2110367864.7 2021.04.06 CN 2120692595.7 2021.04.06
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/00 ; H01Q21/00 ; H01Q21/06

Abstract:
The present disclosure provides an antenna packaging structure radiating e-m waves in a horizontal direction and a vertical direction and a method making the same. The method includes: providing a support substrate, forming a separation layer on a surface of the support substrate; forming a rewiring layer on the separation layer; forming an antenna array layer on the rewiring layer, the antenna array layer is electrically connected to the metal wire layer; the antenna array layer includes first antennas and second antennas arranged in an array respectively, radiating e-m waves in the horizontal direction and the vertical direction respectively; forming a molding material layer; removing the support substrate and the separation layer; forming solder ball bumps on a surface of the rewiring layer away from the antenna array layer, the solder ball bumps are electrically connected to the metal wire layer; disposing a chip on the solder ball bumps.
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