A crimping tool uses a die set with a single point indenter profile to allow of a wide range of electrical connectors and conductors without changing die sets and/or crimping tools. This avoids the need to purchase a separate crimping tool. A die set with an indenter feature in two configurations encompasses the required range of conductors in existing crimping tools, consisting of two pyramid indenter dies and one common wedge die. One advantage of this invention is it allows the strength and versatility of a die set with a single-point indenter without the purchase of a separate crimping tool. The dies of this invention do not require switching out for different sized lugs, thus reducing misplacement and loss. The die halves replace numerous standard U-dies, making the dies of this invention more appealing while offer enhanced pullout strength of connections resulting from this invention.