Invention Grant
- Patent Title: T-splice connector
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Application No.: US17987242Application Date: 2022-11-15
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Publication No.: US12040583B2Publication Date: 2024-07-16
- Inventor: Andrew R. Matcha , Surendra Chitti Babu
- Applicant: Panduit Corp.
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Christopher S. Clancy; James H. Williams; Peter S. Lee
- Main IPC: H01R9/05
- IPC: H01R9/05 ; H01R4/2429 ; H01R4/2433 ; H01R11/15 ; H01R11/09 ; H01R11/11
Abstract:
An apparatus and method for splicing single pair ethernet (SPE) cables. By creating a T shaped intersection, the splicing device allows for sensors and other devices to run perpendicular in relation to the original cable. The splicing device further enables the cable to have multiple drop points along the cable.
Public/Granted literature
- US20230361493A1 T-SPLICE CONNECTOR Public/Granted day:2023-11-09
Information query
