Invention Grant
- Patent Title: Imaging device
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Application No.: US17267117Application Date: 2019-08-19
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Publication No.: US12041368B2Publication Date: 2024-07-16
- Inventor: Taskashi Machida
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross PC
- Priority: JP 18161752 2018.08.30
- International Application: PCT/JP2019/032266 2019.08.19
- International Announcement: WO2020/045142A 2020.03.05
- Date entered country: 2021-02-09
- Main IPC: H04N25/77
- IPC: H04N25/77 ; H01L27/146 ; H04N25/74

Abstract:
An imaging device including a charge-holding section having a larger saturated charge amount is provided. The imaging device includes a first electrically-conductive type semiconductor substrate, a second electrically-conductive type photoelectric conversion section, a second electrically-conductive type charge-holding section, a transfer section, and a trench section. The semiconductor substrate includes a first surface and a second surface opposite thereto. The photoelectric conversion section, embedded in the semiconductor substrate, generates charges corresponding to a light reception amount by photoelectric conversion. The charge-holding section, embedded in the semiconductor substrate, holds the charges generated in the photoelectric conversion section. The transfer section transfers charges from the photoelectric conversion section to a transfer destination. The trench section extends in a thickness direction from the first surface toward the second surface in the charge-holding section. The trench section includes a first base and a first electrically-conductive type first semiconductor layer provided to cover the first base.
Public/Granted literature
- US20210203873A1 IMAGING DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2021-07-01
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