Invention Grant
- Patent Title: Spindle vibration measuring system, spindle vibration measuring method, and program
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Application No.: US16788012Application Date: 2020-02-11
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Publication No.: US12042895B2Publication Date: 2024-07-23
- Inventor: Satoshi Ikai , Daisuke Uenishi , Yuanming Xu
- Applicant: FANUC CORPORATION
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Renner, Otto, Boisselle & Sklar LLP
- Priority: JP 19056918 2019.03.25
- Main IPC: B23Q17/12
- IPC: B23Q17/12 ; B23Q17/00 ; B23Q17/10

Abstract:
A spindle vibration measuring system which measures vibration of a spindle in a machining device that performs a cutting or abrading process on a workpiece. The machining device has a workpiece holder that holds the workpiece, the spindle that holds a tool, and a moving mechanism that relatively moves the workpiece holder and the spindle. The spindle vibration measuring system acquires positional variation data or vibration data of the moving mechanism when the spindle rotates, and a result related to vibration of the spindle to output or store based on the positional variation data or the vibration data.
Public/Granted literature
- US20200306914A1 SPINDLE VIBRATION MEASURING SYSTEM, SPINDLE VIBRATION MEASURING METHOD, AND PROGRAM Public/Granted day:2020-10-01
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