- Patent Title: Ultrasonic horn and manufacturing apparatus of semiconductor device
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Application No.: US17767914Application Date: 2021-06-14
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Publication No.: US12046574B2Publication Date: 2024-07-23
- Inventor: Yuhei Ito , Nobuyuki Aoyagi , Mitsuaki Sakakura , Takuya Asami , Hikaru Miura
- Applicant: SHINKAWA LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINKAWA LTD.
- Current Assignee: SHINKAWA LTD.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- International Application: PCT/JP2021/022560 2021.06.14
- International Announcement: WO2022/264225A 2022.12.22
- Date entered country: 2022-04-10
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23K20/10 ; H01L23/00 ; B23K101/40

Abstract:
An ultrasonic horn (50) includes: a vibration source part (53) to which an ultrasonic vibrator (58) is mounted; a tip end part (56) to which a capillary (18) is mounted; and an intermediate part (54) which is interposed between the tip end part (56) and the vibration source part (53) and propagates vibration generated by the ultrasonic vibrator (58) to the tip end part (56). The intermediate part (54) is formed with a single spiral hole (68) which is a hole penetrating in a radial direction of the ultrasonic horn (50) and advances in an axial direction as the spiral hole advances in a circumferential direction.
Public/Granted literature
- US20230343742A1 ULTRASONIC HORN AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE Public/Granted day:2023-10-26
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