Invention Grant
- Patent Title: Package having bonding layers
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Application No.: US17344928Application Date: 2021-06-10
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Publication No.: US12046579B2Publication Date: 2024-07-23
- Inventor: Ming-Fa Chen , Chao-Wen Shih , Hsien-Wei Chen , Sung-Feng Yeh , Tzuan-Horng Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- The original application number of the division: US16572622 2019.09.17
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L21/304 ; H01L21/56 ; H01L21/683 ; H01L23/00 ; H01L23/31 ; H01L23/538 ; H01L23/544 ; H01L27/12
Abstract:
A package includes a carrier substrate, a first die, and a second die. The first die includes a first bonding layer, a second bonding layer opposite to the first bonding layer, and an alignment mark embedded in the first bonding layer. The first bonding layer is fusion bonded to the carrier substrate. The second die includes a third bonding layer. The third bonding layer is hybrid bonded to the second bonding layer of the first die.
Public/Granted literature
- US20210305214A1 PACKAGE Public/Granted day:2021-09-30
Information query
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