A radio-frequency module includes: a module substrate; a first circuit component and a second circuit component that are disposed inside the module substrate; and a metal shield plate set to a ground potential. The module substrate includes a dielectric part including a first dielectric material, and a dielectric part including a second dielectric material and located inward of the dielectric part, the second dielectric material having a relative permittivity different from that of the first dielectric material. The metal shield plate is disposed between the first circuit component and the second circuit component and in the dielectric part.