Invention Grant
- Patent Title: Multilayer board
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Application No.: US17901018Application Date: 2022-09-01
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Publication No.: US12046838B2Publication Date: 2024-07-23
- Inventor: Koji Kamada , Kunihiro Komaki , Masahiro Izawa , Ryo Komura
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP 20072089 2020.04.14 JP 20151833 2020.09.10
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/48 ; H05K1/16

Abstract:
An element assembly has a structure in which insulator layers including first and second insulator layers are laminated in an up-down direction. The first insulator layer is above the second insulator layer. A radiant conductor layer is on an upper surface of the first insulator layer. A first capacitance defining portion includes a first interlayer connection conductor passing through one or more of the insulator layers in the up-down direction. The first interlayer connection conductor is electrically connected to the radiant conductor layer. The radiant conductor layer, a ground conductor, and the first capacitance defining portion define and function as a patch antenna. When the first interlayer connection conductor is electrically connected to the radiant conductor layer, a distance from a lower end of the first interlayer connection conductor to the ground conductor in the up-down direction is shorter than a distance from the radiant conductor layer to the ground conductor in the up-down direction.
Public/Granted literature
- US20220416425A1 MULTILAYER BOARD Public/Granted day:2022-12-29
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