Invention Grant
- Patent Title: Flexible wiring board, manufacturing method, electronic module, electronic unit, and electronic apparatus
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Application No.: US17877729Application Date: 2022-07-29
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Publication No.: US12048093B2Publication Date: 2024-07-23
- Inventor: Toshiyuki Yoshida , Yu Ogawa
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: JP 21125005 2021.07.30 JP 22082416 2022.05.19
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02 ; H05K1/14

Abstract:
A flexible wiring board includes a signal line and a conductive portion that overlaps the signal line in plan view. The conductive portion includes a first line portion extending in a first direction and having a first part and a second part, a second line portion extending in a second direction and having a third part and a fourth part, and a third line portion. The third line portion has a line width smaller than a line width of the first part and a line width of the second part, is connected to the first and second parts, and is provided between the first part and the second part. The conductive portion includes a fourth line portion that is connected to the third part and the fourth part and that is provided between the third part and the fourth part. The third line portion and the fourth line portion intersect.
Public/Granted literature
Information query