Invention Grant
- Patent Title: Printed circuit board, display module comprising the printed circuit board, display device and method of bonding the printed circuit board
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Application No.: US17405257Application Date: 2021-08-18
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Publication No.: US12048096B2Publication Date: 2024-07-23
- Inventor: Hao Sun , Yong Yu , Chang Zhang , Ge Sun
- Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Sichuan
- Assignee: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Sichuan; CN Beijing
- Agency: WOMBLE BOND DICKINSON (US) LLP
- Priority: CN 2011205836.7 2020.11.02
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; H05K1/14 ; H10K59/12 ; H10K77/10

Abstract:
Embodiments of the application provide a printed circuit board, a display module, a display device and a method of bonding the printed circuit board to a display screen. The printed circuit board includes a plurality of sub-circuit boards and a flexible connector between adjacent sub-circuit boards of the plurality of sub-circuit boards. The flexible connector is configured to connect the adjacent sub-circuit boards of the plurality of sub-circuit boards with each other. For the printed circuit board provided in the embodiments of the application, each sub-circuit board of the printed circuit board can be bonded independently, thereby avoiding pitch accumulation in the bonding region and thus controlling the total pitch within a satisfactory range.
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