Invention Grant
- Patent Title: Electronic device comprising surface-mount device type dipoles, and corresponding assembly method
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Application No.: US17193702Application Date: 2021-03-05
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Publication No.: US12048099B2Publication Date: 2024-07-23
- Inventor: Pierino Calascibetta
- Applicant: STMicroelectronics (Grenoble 2) SAS
- Applicant Address: FR Grenoble
- Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee Address: FR Grenoble
- Agency: Crowe & Dunlevy LLC
- Priority: FR 02455 2020.03.12
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01Q1/22 ; H01Q9/16 ; H05K1/11
Abstract:
A base substrate has a thickness between two faces. The base substrate includes at least one hole extending in a thickness of the base substrate perpendicular to one of the two face. At least one dipole of a surface-mount device type is housed in the at least one hole of the base substrate.
Public/Granted literature
- US20210289630A1 ELECTRONIC DEVICE COMPRISING SURFACE-MOUNT DEVICE TYPE DIPOLES, AND CORRESPONDING ASSEMBLY METHOD Public/Granted day:2021-09-16
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