Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US17746693Application Date: 2022-05-17
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Publication No.: US12048133B2Publication Date: 2024-07-23
- Inventor: Nan Wang
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN 1910295350.8 2019.04.12
- The original application number of the division: US16845641 2020.04.10
- Main IPC: H10B10/00
- IPC: H10B10/00 ; H01L21/02 ; H01L21/8238 ; H01L27/092 ; H01L29/08 ; H01L29/16 ; H01L29/165 ; H01L29/66 ; H01L29/78

Abstract:
Semiconductor structures is provided. The semiconductor structure includes a semiconductor substrate having at least one first region, a plurality of second regions and a plurality of third regions; at least one second fin formed on one second region of the plurality of second region; at least one third fin formed on one third region of the plurality of third regions; a first epitaxial layer formed in the at least one first fin; and a second epitaxial layer formed in the at least one second fin and the at least one third fin.
Public/Granted literature
- US20220278109A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2022-09-01
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