Invention Grant
- Patent Title: Pump apparatus
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Application No.: US18013649Application Date: 2021-08-31
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Publication No.: US12049906B2Publication Date: 2024-07-30
- Inventor: Ryo Takata , Masaharu Nakamura , Masamitsu Watanabe , Hiromichi Hiraki
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 20148970 2020.09.04
- International Application: PCT/JP2021/031916 2021.08.31
- International Announcement: WO2022/050269A 2022.03.10
- Date entered country: 2022-12-29
- Main IPC: F04D29/42
- IPC: F04D29/42 ; F02C3/045 ; F02C3/073 ; F02M37/12 ; F04D1/00 ; F04D13/04 ; F04D29/24

Abstract:
A pump apparatus includes: a rotational shaft; a hub portion mounted to the rotational shaft; a centrifugal pump vane mounted to a circumferential surface of the hub portion; an annular disc portion mounted to a tip end of the centrifugal pump vane; and an axial turbine blade mounted to an outer circumferential surface of the annular disc portion. A liquid flow passage through which a liquid flowing from a first side toward a second side in an axis direction of the rotational shaft flows into the centrifugal pump vane is formed at a radially inner side of the annular disc portion, and a gas flow passage through which a gas flowing from the second side toward the first side passes through the axial turbine blade is formed at a radially outer side of the annular disc portion.
Public/Granted literature
- US20230358252A1 PUMP APPARATUS Public/Granted day:2023-11-09
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