Invention Grant
- Patent Title: Low inductance component
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Application No.: US18194675Application Date: 2023-04-03
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Publication No.: US12051548B2Publication Date: 2024-07-30
- Inventor: Michael W. Kirk , Marianne Berolini
- Applicant: KYOCERA AVX Components Corporation
- Applicant Address: US SC Fountain Inn
- Assignee: KYOCERA AVX Components Corporation
- Current Assignee: KYOCERA AVX Components Corporation
- Current Assignee Address: US SC Fountain Inn
- Agency: Dority & Manning, P.A.
- Main IPC: H01G4/38
- IPC: H01G4/38 ; H01G4/12 ; H01G4/40 ; H01L27/08 ; H01L49/02

Abstract:
A low inductance component may include a multilayer, monolithic device including a first active termination, a second active termination, at least one ground termination, and a pair of capacitors connected in series between the first active termination and the second active termination. The lead(s) may be coupled with the first active termination, second active termination, and/or the at least one ground termination. The lead(s) may have respective length(s) and maximum width(s). A ratio of the length(s) to the respective maximum width(s) of the lead(s) may be less than about 20.
Public/Granted literature
- US20230238186A1 Low Inductance Component Public/Granted day:2023-07-27
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