Invention Grant
- Patent Title: Semiconductor devices having different numbers of stacked channels in different regions
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Application No.: US18168332Application Date: 2023-02-13
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Publication No.: US12051694B2Publication Date: 2024-07-30
- Inventor: Chang-Woo Noh , Jae-Hyeoung Ma , Dong-Il Bae
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. CHAU & ASSOCIATES, LLC
- Priority: KR 20180075616 2018.06.29
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/02 ; H01L21/308 ; H01L21/8234 ; H01L29/10 ; H01L29/165 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device may include first channels on a first region of a substrate and spaced apart from each other in a vertical direction substantially perpendicular to an upper surface of the substrate, second channels on a second region of the substrate and spaced apart from each other in the vertical direction, a first gate structure on the first region of the substrate and covering at least a portion of a surface of each of the first channels, and a second gate structure on the second region of the substrate and covering at least a portion of a surface of each of the second channels. The second channels may be disposed at heights substantially the same as those of corresponding ones of the first channels, and a height of a lowermost one of the second channels may be greater than a height of a lowermost one of the first channels.
Public/Granted literature
- US20230197719A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2023-06-22
Information query
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