Invention Grant
- Patent Title: Acoustic wave devices
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Application No.: US17676079Application Date: 2022-02-18
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Publication No.: US12052012B2Publication Date: 2024-07-30
- Inventor: Michio Kadota , Shuji Tanaka
- Applicant: TOHOKU UNIVERSITY
- Applicant Address: JP Sendai
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US CA Irvine
- Agency: Chang & Hale LLP
- Priority: JP 16228508 2016.11.25 JP 17095057 2017.05.11
- Main IPC: H03H9/54
- IPC: H03H9/54 ; H03H9/02 ; H03H9/64

Abstract:
An acoustic wave device that has a better TCF and can improve a resonator Q or impedance ratio is provided. The acoustic wave device includes a substrate 11 containing 70 mass % or greater of silicon dioxide (SiO2), a piezoelectric thin film 12 including LiTaO3 crystal or LiNbO3 crystal and disposed on the substrate 11, and an interdigital transducer electrode 13 disposed in contact with the piezoelectric thin film 12.
Public/Granted literature
- US20220173720A1 ACOUSTIC WAVE DEVICES Public/Granted day:2022-06-02
Information query
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