Invention Grant
- Patent Title: Circuit mounting assemblies
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Application No.: US17943980Application Date: 2022-09-13
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Publication No.: US12052813B2Publication Date: 2024-07-30
- Inventor: Francis C. Belisle , Robert C. Cooney , Catherine Canciamille , Nhia Yang
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US NC Charlotte
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K7/14
Abstract:
A circuit mounting assembly can include a circuit board, a chassis, a sheet of thermally conductive dielectric material, and one or more fasteners configured to compress the sheet between the circuit board and the chassis to provide vibration isolation and electrical isolation between the chassis and the circuit board, and to provide thermal conduction between the chassis and the circuit board.
Public/Granted literature
- US20240090115A1 CIRCUIT MOUNTING ASSEMBLIES Public/Granted day:2024-03-14
Information query
