A laser machining apparatus includes a laser oscillator, a laser machining head including a housing, first and second optical elements configured to change a beam profile of a laser beam supplied into the housing to first and second beam profiles, a selector driving member configured to move each of the first and second optical elements between an advanced position and a retracted position relative to a luminous flux, and a control device configured to control the selector driving member to selectively shift to a first mode to maintain the first and second optical elements at the retracted position, a second mode to maintain only the first optical element at the advanced position, and a third mode to maintain only the second optical element at the advanced position, the control device being configured to stop the laser beam when the first and second optical elements move.