A repair method for a component having a damaged portion on a surface thereof includes obtaining a feedstock mixture comprising base material particles and a binder, forming a preform with the feedstock mixture, placing the preform on the damaged portion of the surface of the component, and subjecting the component and the preform to at least one thermal cycle for forming a metallurgical bond in a solid state between the preform and the surface of the component after the at least one thermal cycle, the at least one thermal cycle occurring below a melting temperature of the component and the preform. A repair method involving pouring fluid feedstock mixture on a damaged portion of the surface of the component is also disclosed.