Invention Grant
- Patent Title: Cutting device
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Application No.: US17702966Application Date: 2022-03-24
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Publication No.: US12053900B2Publication Date: 2024-08-06
- Inventor: Yasuhito Shikama , Naoya Sakai , Kentaro Sugiyama
- Applicant: BROTHER KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Nagoya
- Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Nagoya
- Agency: K&L Gates LLP
- Priority: JP 21053547 2021.03.26
- Main IPC: B26F1/38
- IPC: B26F1/38 ; B26D7/01 ; B26D7/26 ; B26D7/00

Abstract:
A cutting device includes a platen, a mounting portion, a movement mechanism, a processor, and a memory. The memory is configured to store computer-readable instructions that, when executed by the processor, instruct the processor to perform processes including acquiring a hardness-correspondence value corresponding to a hardness of a cutting object placed on the platen, acquiring cutting data for cutting a pattern from the cutting object, setting, based on the hardness-correspondence value, an offset amount used for a rotation correction to a greater value when the hardness of the cutting object is hard than when the hardness of the cutting object is soft, correcting, using the set offset amount, data, of the cutting data, corresponding to a direction change section, and performing cutting processing to cut the cutting object using a cutting blade, by controlling the movement mechanism in accordance with the corrected cutting data.
Public/Granted literature
- US20220305690A1 CUTTING DEVICE Public/Granted day:2022-09-29
Information query
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