Invention Grant
- Patent Title: Connector and heat sink
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Application No.: US16881536Application Date: 2020-05-22
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Publication No.: US12055353B2Publication Date: 2024-08-06
- Inventor: Jin Jiwang , Liu WenYu , Han Hongqiang , Ge Xingjie
- Applicant: Tyco Electronics (Shanghai) Co. Ltd.
- Applicant Address: CN Shanghai
- Assignee: Tyco Electronics (Shanghai) Co., Ltd.
- Current Assignee: Tyco Electronics (Shanghai) Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Barley Snyder
- Priority: CN 1910443488.8 2019.05.24
- Main IPC: F28F9/26
- IPC: F28F9/26 ; F28F1/12 ; H01R13/46

Abstract:
A connector includes a housing, a heat sink mounted on a top wall of the housing, and an elastic clip. The housing has an inserting cavity, a first connecting portion on a first side, and a second connecting portion on a second side. The heat sink has a base, a heat sink body mounted on the base, and a through hole formed at a bottom of the heat sink body and extending laterally through the heat sink body. The elastic clip has an elastic lateral beam extending laterally through the through hole. The elastic lateral beam has a first mating connecting portion at a first end and a second mating connecting portion at a second end. The first mating connecting portion engages the first connecting portion and the second mating connecting portion engages the second connecting portion, elastically holding the heat sink on the top wall.
Public/Granted literature
- US20200370843A1 CONNECTOR AND HEAT SINK Public/Granted day:2020-11-26
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